00L-3 Cincinnati Electronics is uniquely positioned to develop and produce advanced packaging technology for sophisticated sensors and MicroElectroMechanicalSystems (MEMS). L-3 CE is committed to an expanded program of research and development for continually improving existing technologies and developing new capabilities for its diverse lines of sensor and MEMS assemblies for use today… and well into the future.
00L-3 CE has an exclusive combination of in-house process capabilities to position itself as state of the art sensor/MEMS packaging provider:

  • Wafer fabrication capability providing batch processing
  • Bump bonding for extremely high density interconnect
  • Laser welding of standard and custom housing shapes constructed of a variety of materials
  • Hermetic, cryogenic and vacuum packaging to achieve optimum sensor device performance
  • Integration of sensor support electronics through hybrid assembly techniques

Sensor and MEMS Applications:

  • Infrared Imaging Sensors
  • X-Ray Imaging Sensors
  • Detector and Missile Seeker Assemblies
  • Resonating gyroscope MEMS
  • Ceramic-based microsensors

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