L-3 Cincinnati Electronics Offers Advanced Packaging Capabilities and Technology:
00L-3 Cincinnati Electronics offers a complete range of advanced high reliability microelectronics packaging capabilities that provide users with long-term strategic solutions to virtually any packaging technology problem.

L-3 CE Provides a Precise Design Solution:
00L-3 CE’s outstanding capabilities in design, simulation, assembly and test will provide the precise design solution to most any advanced packaging need.

  • 3D mechanical design and simulation tools including FEA and thermal analysis
  • Electrical design simulation
  • Advanced materials, processes and fabrication techniques
  • Complete design validation through device characterization and test

00L-3 CE also performs build-to-print packaging projects where the customer design is already established.

 

L-3 CE Offers a Wide Variety of Advanced Packaging Assembly and Test Capabilities:
00L-3 CE has in-house capability for full front to back end assembly processes.

  • Thick and thin film substrate fabrication
  • Automatic epoxy die attach
  • Eutectic and solder alloy die attach
  • Automatic thermosonic and thermocompression wirebonding
  • Parallel gap and tweezer welding
  • Laser, one-shot resistance, and parallel seam package sealing

00L-3 CE performs an assortment of thermal, mechanical, and electrical testing

  • 100% environmental screening to MIL-PRF-38534
  • First article and qualification testing to customer requirements
  • Manual and automatic room, hot, and cold electrical testing

Click here for information about HMAs and MCMs
Click here for information on Sensors and MEMS